Wednesday, February 13, 2008

The operation of SDRAM in relation to latency:

The operation of SDRAM in relation to latency:

We have already covered topics relating to refresh and latency above. We have defined the RAS Cycle (tRC), the RAS Precharge Cycle (tRP), tRAS, AUTO REFRESH and AUTO PRECHARGE as well as the impact of continuous reads or writes versus short reads and writes on these parameters. Now we can look more closely at the process of activating a bank and reading or writing data to that bank.

As discussed previously, commands and data addresses control access to banks of data. Commands are issued by holding the voltage low or high across several leads. Four very important leads are CS#, RAS#, CAS# and WE#. When CS# is high the other three leads are ignored. When CS# is held low the voltages across RAS#, CAS# and WE# determine a set of commands used to manipulate the bank in question.

Commands issued for values of RAS#, CAS# and WE# when CS# is Low
RAS# CAS# WE# Meaning
LOW HIGH HIGH Bank Activate
LOW HIGH LOW Bank Precharge
HIGH LOW HIGH WRITE
HIGH LOW LOW READ
HIGH HIGH X Power Down
LOW LOW HIGH Self Refresh
HIGH HIGH LOW BURST STOP
HIGH HIGH HIGH NOP (Non-Operational) similar to CS# High
LOW LOW LOW Mode Register Set
To access data an address must be setup before the clock by about 1 clock cycle (tAS). Then the ACTIVATE (RAS) command must be executed on an idle bank to put it in an active mode. A READ or WRITE (CAS) command is issued after the ACTIVE (RAS) command. The period between the ACTIVE command and the subsequent READ or WRITE command is the

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